2024     2023     2022     2021     2020     2019     2018     2017     2016     2015     2014     < 2013     专利    

论文

2024

  • Yulian Peng, Houping Wu, Zhengyan Wang, Yufeng Wang, & Hongbo Wang*
    A Soft Inductive Bimodal Sensor for Proprioception and Tactile Sensing of Soft Machines [DOI]
    Soft Robotics, Published online (2024).

  • Xinxin Chang, Zhengyan Wang, Yulian Peng, Houping Wu, Liansheng Zhang, & Hongbo Wang*
    Sub-Micrometer Resolution Self-Displacement Sensing for Electromagnetic Actuators [DOI]
    IEEE Transactions on Industrial Electronics, Early Access (2024).

  • Shisheng Zhang†, Yingao Xu†, Xinxin Chang, Jinxing Wang, Tonglin Li, Houpin Wu, & Hongbo Wang*
    A fully integrated, Reconfigurable Multi-Axis Force Sensor via inductive displacement sensing [DOI]
    IEEE Sensors Journal, 24(7), 9593-9603 (2024).

2023

  • Chao Tang, Xinxin Chang, Jinxing Wang, Yulian Peng, Houping Wu, & Hongbo Wang*
    A Nonarray Soft Capacitive Tactile Sensor with Simultaneous Contact Force and Location Measurement for Intelligent Robotic Grippers [DOI]
    IEEE Transactions on Instrumentation and Measurement,73, 9503509 (2023).

  • Selvaraj Veerapandian#, Junchen Luo#, Mingyu Kwak, Zhengyan Wang, Yebin Park, Ighyun Lim, Hongbo Wang* & Unyong Jeong*
    Two-Terminal Deformable Induction Array Sensor Capable of Recognizing Non-Contact Dynamic Motions of Various Objects [DOI]
    Advanced Functional Materials, 33, 2305776 (2023).

2022

  • Zhengyan Wang, Houping Wu, Zhihua Feng & Hongbo Wang*
    A Stick on, Film-like, Split Angle Sensor via Magnetic Induction for Versatile Applications [DOI]
    IEEE Transactions on Instrumentation and Measurement, 71, 9510309 (2022).

  • Junda Huang, Jianshu Zhou*, Zhengyan Wang, Jones Law, Hanwen Cao, Yichuan Li, Hongbo Wang* & Yunhui Liu
    Modular Origami Soft Robot with the Perception of Interaction Force and Body Configuration [DOI]
    Advanced Intelligent Systems, 4(7), 2200081 (2022).

2021

  • Selvaraj Veerapandian#, Woosun Jang#, Jae Bok Seol, Hongbo Wang, Minsik Kong, Kaliannan Thiyagarajan, Junghyeok Kwak, Gyeongbae Park, Gilwoon Lee, Wonjeong Suh, Insang You, Mehmet Emin Kılıç, Anupam Giri, Lucia Beccai, Aloysius Soon* & Unyong Jeong*
    Hydrogen-doped viscoplastic liquid metal microparticles for stretchable printed metal lines [DOI]
    Nature Materials, 20, 533–540 (2021).

  • Seonggun Joe*, Hongbo Wang, Massimo Totaro & Lucia Beccai*
    Sensing Deformation in Vacuum Driven Foam-Based Actuator via Inductive Method [DOI]
    Frontier in Robotics and AI, 8, 742885 (2021).

  • Seonggun Joe*, Massimo Totaro, Hongbo Wang & Lucia Beccai*
    Development of the Ultralight Hybrid Pneumatic Artificial Muscle: Modelling and optimization [DOI]
    PLoS ONE, 16(4), 0250325 (2021).

2020

  • Hongbo Wang*, Massimo Totaro, Selvaraj Veerapandian, Muhammad Ilyas, Minsik Kong, Unyong Jeong & Lucia Beccai*
    Folding and Bending Planar Coils for Highly Precise Soft Angle Sensing [DOI]
    Advanced Materials Technologies, 5(11), 2000659 (2020).

  • Massimo Totaro*, Irene Bernardeschi, Hongbo Wang & Lucia Beccai
    Analysis and optimization of fully foam-based capacitive sensors [DOI]
    2020 3rd IEEE International Conference on Soft Robotics (RoboSoft), New Haven, CT, USA, May 15 - July 15, 2020.

  • Seonggun Joe*, Massimo Totaro, Hongbo Wang & Lucia Beccai
    Development of Ultralight Hybrid Pneumatic Artificial Muscle for Large Contraction and High Payload [DOI]
    2020 3rd IEEE International Conference on Soft Robotics (RoboSoft), New Haven, CT, USA, May 15 - July 15, 2020.

2019

  • Hongbo Wang*, Massimo Totaro, Afroditi Astreinidi Blandin & Lucia Beccai
    A Wireless Inductive Sensing Technology for Soft Pneumatic Actuators Using Magnetorheological Elastomers [DOI]
    2019 2nd IEEE International Conference on Soft Robotics (RoboSoft), Seoul, South Korea, April 14-18, 2019.

  • Hongbo Wang*, Irene Bernardeschi & Lucia Beccai
    Developing Reliable Foam Sensors with Novel Electrodes [DOI]
    2019 IEEE SENSORS, Montreal, QC, Canada, Oct. 27-30, 2019.

  • Hongbo Wang*, Massimo Totaro & Lucia Beccai
    Development of Fully Shielded Soft Inductive Tactile Sensors [DOI]
    2019 26th IEEE International Conference on Electronics, Circuits and Systems (ICECS), Genoa, Italy, Nov. 27-29 2019.

2018

  • Hongbo Wang*, Massimo Totaro & Lucia Beccai*
    Toward Perceptive Soft Robots: Progress and Challenges [DOI]
    Advanced Science, 5(9), 201800541 (2018).

  • Hongbo Wang*, Jun Wai Kow, Nicholas Raske, Gregory de Boer, Mazdak Ghajari, Robert Hewson, Ali Alazmani & Peter Culmer
    Robust and high-performance soft inductive tactile sensors based on the Eddy-current effect [DOI]
    Sensors and Actuators A: Physical, 271, 44-52 (2018).

  • Hongbo Wang*, Dominic Jones, Gregory de Boer, Junwai Kow, Lucia Beccai, Ali Alazmani & Peter Culmer
    Design and Characterization of Tri-Axis Soft Inductive Tactile Sensors [DOI]
    IEEE Sensors Journal, 18(19), 7793-7801 (2018).

2017

  • Hongbo Wang*, Greg de Boer, Junwai Kow, Mazdak Ghajari, Ali Alazmani, Robert Hewson & Peter Culmer
    A Low-cost Soft Tactile Sensing Array Using 3D Hall Sensors [DOI]
    Procedia Engineering, 168, 650-653 (2017).

  • Hongbo Wang*, Junwai Kow, Greg de Boer, Dominic Jones, Ali Alazmani & Peter Culmer*
    A low-cost, high-performance, soft tri-axis tactile sensor based on eddy-current effect [DOI]
    2017 IEEE SENSORS, Glasgow, Scotland, UK, Oct.29 - Nov.1, 2017.

  • Dominic Jones, Hongbo Wang, Ali Alazmani & Peter Culmer
    A Soft Multi-Axial Force Sensor to Assess Tissue Properties in Real Time [DOI]
    2017 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), Vancouver, BC, Canada, Sept. 24-28, 2017

  • Shehran Azim, Abhinandan Srinivasan, Muthukumar Pandaram, Junwai Kow, Greg de Boer, Hongbo Wang, Ali Alazmani & Peter Culmer*
    Soft tactile sensors with variable compliance [DOI]
    2017 IEEE SENSORS, Glasgow, Scotland, UK, Oct.29 - Nov.1, 2017.

  • Gregory de Boer*,Nicholas Raske, Hongbo Wang, Junwai Kow, Ali Alazmani, Mazdak Ghajari, Peter Culmer & Robert Hewson
    Design Optimisation of a Magnetic Field Based Soft Tactile Sensor [DOI]
    Sensors, 17(11), 2539 (2017).

2016

  • Hongbo Wang*, Gregory de Boer, Junwai Kow, Ali Alazmani, Mazdak Ghajari, Robert Hewson & Peter Culmer
    Design Methodology for Magnetic Field-Based Soft Tri-Axis Tactile Sensors [DOI]
    Sensors, 16(9), 1356 (2016).

  • Wei Li, Hongbo Wang & Zhihua Feng*
    Non-contact online thickness measurement system for metal films based on eddy current sensing with distance tracking technique [DOI]
    Review of Scientific Instruments, 87, 045005 (2016).

  • Greg de Boer*, Hongbo Wang, Mazdak Ghajari, Ali Alazmani, Robert Hewson & Peter Culmer
    Force and Topography Reconstruction Using GP and MOR for the TACTIP Soft Sensor System [DOI]
    Annual Conference Towards Autonomous Robotic Systems, Sheffield, UK, June 26 - July 1, 2016.

2015

  • Hongbo Wang, Wei Li & Zhihua Feng*
    Non-contact Thickness Measurement of Metal Films Using Eddy Current Sensor Immune to Distance Variation [DOI]
    IEEE Transactions on Instrumentation and Measurement, 64(9), 2557-2564 (2015).

  • Hongbo Wang, Wei Li & Zhihua Feng*
    A Compact and Sensitive Eddy Current Sensor Based on Meander-Spiral Coil [DOI]
    IEEE Transactions on Magnetics, 51(9), 4003806 (2015).

  • Hongbo Wang, Wei Li & Zhihua Feng*
    Note: Eddy current displacement sensors independent of target conductivity [DOI]
    Review of Scientific Instruments, 86(1), 016118 (2015).

  • Bin Ju, Weiwei Shao, Liansheng Zhang, Hongbo Wang & Zhihua Feng*
    Piezoelectric ceramic acting as inductor for capacitive compensation in piezoelectric transformer [DOI]
    IET Power Electronics, 8(10), 2009-2015 (2015).

2014

  • Hongbo Wang, Bin Ju, Wei Li & Zhihua Feng*
    Ultrastable Eddy Current Displacement Sensor Working in Harsh Temperature Environments with Comprehensive Self-Temperature Compensation [DOI]
    Sensors and Actuators A: Physical, 211, 98-104 (2014).

  • Hongbo Wang* & Zhihua Feng
    Design of ultrastable and high resolution eddy-current displacement sensor system [DOI]
    IECON 2014 - 40th Annual Conference of the IEEE Industrial Electronics Society, Dallas, TX, USA, Oct.29 - Nov.1, 2014.

  • Wei Li, Hongbo Wang & Zhihua Feng*
    Ultrahigh-resolution and non-contact diameter measurement of metallic wire using eddy current sensor [DOI]
    Review of Scientific Instruments,85(8), 085001 (2014).

  • Qiaosheng Pan, Qi Zhang, Hongbo Wang, Wei Li & Zhihua Feng*
    Piezoelectric linear motor using resonant-type clamping based on harmonic vibration synthesis [DOI]
    Mechatronics, 24(8), 1112-1119 (2014).

2013

  • Hongbo Wang & Zhihua Feng*
    Ultrastable and highly sensitive eddy current displacement sensor using self-temperature compensation [DOI]
    Sensors and Actuators A: Physical, 203, 362-368 (2013).

  • Liangguo He, Chengliang Pan, Hongbo Wang & Zhihua Feng*
    Note: Arbitrary periodical mechanical vibrations can be realized in the resonant state based on multiple tuning fork structure [DOI]
    Review of Scientific Instruments, 84(9), 096104 (2013).

2012

  • Hongbo Wang & Zhihua Feng*
    A Highly Sensitive Magnetometer Based on the Villari Effect [DOI]
    IEEE Transactions on Magnetics, 49(4), 1327-1333 (2012).

2011

  • Jing Yin, Chengliang Pan, Hongbo Wang & Zhihua Feng*
    A high-sensitive static vector magnetometer based on two vibrating coils [DOI]
    Review of Scientific Instruments, 82(12), 124702 (2011).

专利

  • 王洪波,徐迎澳,吴后平,张世晟,常新新,一种电感式可重构多维力传感器 [Link]
    发明专利, 2024-02-05, 中国,ZL 202410163198.9(授权)

  • 王洪波,彭玉连,王正岩,吴后平,常新新,基于裂纹间隙磁阻调制的双向弯曲传感器 [Link]
    发明专利, 2023-10-26,中国,ZL 202311395900.6 (授权)

  • 王洪波,常新新,王正岩,吴后平,彭玉连,一种电磁致动器的位移自感知装置 [Link]
    发明专利, 2023-10-20, 中国,CN202311365973.0(实质审查)

  • 王洪波,王正岩,吴后平,冯志华,一种感应式柔性角度传感薄膜 [Link]
    发明专利, 2022-06-08,中国, ZL 202210638071.9 (授权)

  • 冯志华,王洪波,李伟,琚斌,基于电涡流传感器的导电膜厚度测量系统及方法 [Link]
    发明专利,2014-12-17,中国,ZL 201410412326.5(授权)

  • 冯志华,王洪波,刘永斌,李伟,张连生,一种电涡流位移传感器温度漂移系数的测量装置 [Link]
    发明专利,2014-4-16,中国,ZL 201310740208.2(授权)

  • 冯志华,王洪波,李伟,刘永斌,张连生,一种利用电桥分离感抗和电阻微小变化的解调电路 [Link]
    发明专利,2014-2-5,中国,ZL 201310462027.8(授权)

  • 冯志华,王洪波,刘永斌,李伟,陈建,一种电涡流传感器的温度漂移自动校正方法 [Link]
    发明专利,2014-1-22,中国,ZL 201310396067.7(授权)

返回页首